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AppliedMicro Circuits Corporation (Nasdaq:AMCC), a global leader in computing and connectivity solutions, today announced performance targets for the company’s next-generation Server-on-a-Chip® solution, X-Gene® 3. AppliedMicro’s new X‑Gene 3 processor design combines 32 high performance ARMv8-compatible CPU cores in a single socket to deliver performance competitive with mainstream high-end Xeon E5/E7 processors in a similar TDP envelope. With eight DDR4 memory channels, X‑Gene 3 even outclasses Xeon E5 in memory bandwidth, making it well suited to hyperscale workloads, such as in-memory databases, big data, machine learning, web search and HPC.
AppliedMicro’s X-Gene 3 features 32 ARMv8-A 64-bit CPU cores running at up to 3.0 GHz, eight DDR4-2667 memory channels addressing up to one terabyte of memory, 42 lanes of PCI Express 3.0, 4 SATA 3.0, 2 USB 2.0 ports and 1 RGMII port. X-Gene 3 builds upon the foundation of two generations of server products that have been proven in a variety of datacenter, storage and HPC applications.
“I am thrilled to share with you that we have made tremendous progress in X-Gene 3 development. X-Gene 3 is targeted at over six times the performance of currently shipping X-Gene products, and very competitive with mainstream high-end Xeon processors for hyperscale workloads,” said Parag Jain, AppliedMicro’s associate vice president of processor products. “This is an unprecedented level of overall performance and best in-class performance-per-watt for ARM processors.”
Linley Gwennap, principal analyst of The Linley Group said, “Based on what I have learned from AppliedMicro and observed in their labs, X-Gene 3 promises to be the breakthrough ARM-based processor that the data center market has long desired for general purpose computing and mainstream workloads. Earlier-generation ARMv8-A processors like X-Gene and X-Gene 2 have an important role in specialized applications like NFV/SDN and storage, but X-Gene 3 is a disruptive product with the potential to change the game for general-purpose cloud computing.”
X-Gene 3 is expected to sample in the second half of 2016, leading to production shipments in 2H’17. The Linley Group has published a white paper on X-Gene 3, which is available at www.linleygroup.com.
Applied Micro Circuits Corporation (NASDAQ: AMCC) is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and datacenters. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Santa Clara, California. www.apm.com.
(C) Copyright 2016, Applied Micro Circuits Corporation. AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.
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X-GeneTM and X-WeaveTM represent new, grounds-up Cloud Server and connectivity solutions tailored for next generation data centers.
Our high-speed OTN connectivity products include a broad array of physical layer, framer, and mapper solutions.
Our embedded processors are widely deployed in markets such as NAS devices, wireless LAN, multi-function printers and networking equipment.
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