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Applied Micro Circuit, BrPhotonics and Macom Technology have announced what they claim is the first successful demonstration of 100Gb/s PAM4 single wavelength (lambda) technology over singlemode fibre.
The will be showing the technology in AppliedMicro’s Booth, at ECOC 2016 taking place at the CCD Congress (Stockumer Kirchstraße 61, 40474 Düsseldorf, Germany) from Sept. 19-21, 2016.
The solution features AppliedMicro’s 16nm FinFET 100Gb/s PAM4 DSP, BrPhotonics’ newest high bandwidth TFPS (Thin Film Polymer on Silicon) modulator and Macom’s high bandwidth, low noise transimpedance amplifier (TIA).
Single wavelength 100Gb/s are expected to transform the market for 100Gb/s and 400Gb/s intra-datacentre interconnects by enabling deployments of 100Gb/s QSFP, 400Gb/s double density QSFP and 800Gb/s CFP8 modules.
For 100Gb/s, this technology reduces the number of lasers to one and eliminates the need for optical multiplexing. For 400Gb/s implementations, only four lasers are needed, representing a major opportunity for datacentre operators to reduce capital expenditures (CAPEX) and operating expenses (OPEX) with an extremely compact module form factor.
“As datacentre and access network developers demand lower costs and higher port density, we’ve seen huge market interest in our single wavelength PAM-4 technology,” said Omar Hassen, associate VP at AppliedMicro. “AppliedMicro’s technology is fundamental in enabling 400Gb/s connectivity in a QSFP family of transceivers. This is a feat that has not been achieved previously and our demonstration in partnership with Macom and BrPhotonics underscores the strength of our technology and the innovation that we’re able to deliver to end customers.”
“This joint achievement was a very important step forward by the industry in providing state of the art solutions for next-generation datacentre interconnects. Thanks to APM and Macom, we, at BrPhotonics, are very pleased in showing our 100GHz TFPS Mach-Zehnder Modulator (MZM) technology to the world,” said Júlio Oliveira, BrPhotonics’ CEO.
“Macom is proud to partner in this demonstration,” said Gary Shah, VP, high-performance analogue, Macom. “This 56 Gigabaud TIA, developed in silicon, demonstrates our leadership in physical media devices as we enable the next generation of datacentre optical interconnects.”
“The industry requires significantly lower cost optical 100Gb/s connections for datacentre and access network applications and will be moving to 400G in datacentres during 2018/19. Single wavelength PAM4 100Gb/s promises a cost effective solution for 100Gb/s and enables high density 400G connections in the datacentre. This demonstration shows that this technology is coming faster than many people think,” said Simon Stanley, founder and principal consultant at Earlswood Marketing Ltd, and analyst at large with Heavy Reading.
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