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AppliedMicro Introduces X-Tend™: Breakthrough Scale-out Interconnect Technology

November 16, 2015 | in Press Releases

X-Tend Leverages Open Standards-based Technologies to Provide Ultra High Density Scale Out and Virtual Scale-Up Servers

Santa Clara, CA (GLOBE NEWSWIRE) Nov. 16, 2015 – Applied Micro Circuits Corporation (Nasdaq:AMCC), a global leader in computing and connectivity solutions, today announced the availability of X-Tend™ interconnect technology, enabling multiple generations of X-Gene® SoCs to be connected seamlessly with large, elastic memory pools.

Emerging data center workloads, including data mining, real-time analytics, predictive analysis and machine learning, demand minimal latency with just-in-time, elastic provisioning of compute and memory resources. Comprised of on-chip and software components, X-Tend connects multiple X-Gene nodes to each other while presenting multiple terabytes of shared DRAM memory as a single cluster.

“The work that went into AppliedMicro’s X-Tend interconnect is a real engineering accomplishment,” said Jimmy Pike, technologist in residence at Moor Insights and Strategy. “The promise of X-Tend to provide a single interconnect system that serves as the physical layer for large scale-out solutions and at the same time provide the means for virtual scale-up solutions represents a substantial step forward for AppliedMicro and the ARM server ecosystem.”

“X-Tend utilizes open standards, including PCI Express, to provide multi-socket configurations with a single symmetric multiprocessor OS image, accessing huge memory pools with very low latency,” said Paramesh Gopi, president and CEO, AppliedMicro. “On-demand scale-up capability is particularly applicable to compute-intensive workloads like high-performance computing and advanced search algorithms.”

X-Tend evaluation platforms are already shipping to AppliedMicro’s customers. Additionally, the company will feature a live demonstration of X-Tend in booth No. 3103 at SC15 in Austin, Texas, Nov. 16 - Nov. 19, 2015.

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X-GeneTM and X-WeaveTM represent new, grounds-up Cloud Server and connectivity solutions tailored for next generation data centers.

Our high-speed OTN connectivity products include a broad array of physical layer, framer, and mapper solutions.

Our embedded processors are widely deployed in markets such as NAS devices, wireless LAN, multi-function printers and networking equipment.

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