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Santa Clara, CA (GLOBE NEWSWIRE) Nov. 16, 2015 – Applied Micro Circuits Corporation (Nasdaq:AMCC), a global leader in computing and connectivity solutions, last week at ARM TechCon announced its third generation Server-on-a-Chip ® solution, X-Gene® 3.
X-Gene 3 builds on two generations of enterprise class server on chip products that are currently shipping to leading edge enterprise and data center end customers.
The newest member of the X-Gene family, fabricated in TSMC’s 16 nanometer FinFET process, will feature 32 brawny cores operating at speeds up to 3.0 GHz, eight DDR4-2667 memory channels and 42 PCIe Gen 3 lanes. Performance is expected to be four-to-six times that of the currently shipping X-Gene family of products.
“We are finally ready to take the lid off something we have been working on for the last two years in stealth mode,” said AppliedMicro’s President and CEO, Dr. Paramesh Gopi. Displaying an X-Gene 3 test vehicle for the ARM TechCon audience, Dr. Gopi added, “The proof is in my hand. We are really excited because X-Gene 3 gives us the opportunity to inflect the entire (ARM server) market.”
“X-Gene 3 will offer hyperscale data center operators a strong option for both performance and power efficient computing,” said Paul Teich, principal analyst at TIRIAS Research. “We see X-Gene 3 and AppliedMicro’s industry partnerships as a potential game changer, enabling ARM servers to address demanding scale-out workloads such as data mining, real time and predictive analytics, and deep learning”
AppliedMicro expects to sample X-Gene 3 in the second half of 2016.
X-GeneTM and X-WeaveTM represent new, grounds-up Cloud Server and connectivity solutions tailored for next generation data centers.
Our high-speed OTN connectivity products include a broad array of physical layer, framer, and mapper solutions.
Our embedded processors are widely deployed in markets such as NAS devices, wireless LAN, multi-function printers and networking equipment.
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