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APM & TE Connectivity Collaborate to Develop High-Speed Cable Connectivity Solutions

March 23, 2015 | in Press Releases

AppliedMicro and TE Connectivity Collaborate to Develop High-Speed Cable Connectivity Solutions for Data Center Networks

LOS ANGELES, March 23, 2015 (GLOBE NEWSWIRE)— Applied Micro Circuits Corporation (Nasdaq:AMCC) and TE Connectivity (NYSE:TEL) today announced their collaboration to develop high-speed cable connectivity solutions for data center networks.

The collaboration will result in active copper cables for connecting servers to top-of-rack (TOR) switches at 50Gbps and 40Gbps speeds using AppliedMicro’s DSP-based transceiver and TE Connectivity’s high-speed copper cable assemblies.

Rapid growth in data center and the ever-increasing CPU density within a rack typically create challenges in managing cable connections to the TOR switches while still maintaining the airflow required for cooling. By enabling market leading bandwidth over copper cables, data center operators will be able to reduce the number of cables connecting CPUs to TOR switches by up to 75 percent resulting in higher manageability, better cooling and lower cost.

“TE’s high-performance copper cable assemblies, based on Madison TurboTwin parallel pair copper cable with unique drainless construction, provide the low insertion loss and low cross-talk margin necessary to support both NRZ and PAM4 signaling as will be required by networking and hyper-scale computing customers,” said Omar Hassen, Associate Vice President at AppliedMicro. “Available in a broad range of wire gauges from 24 to 33 gauge and with cables from two pairs up to eight pairs in jacketed cable and breakout configurations, TE’s copper cable assemblies are ideal for connecting server clusters, switches, routers and transport equipment in current and future data center requirements.”

“AppliedMicro’s 28nm low-power, high-speed PAM transceivers represent tremendous value to data center operators. They reside at the heart of cost, performance and manageability that will be required by tomorrow’s cloud-based economy,” said Arash Behziz, technologist on TE’s system architecture team.

AppliedMicro and TE Connectivity will be showcasing their high-speed cable connectivity solutions at OFC in Los Angeles, booth no. 2631.

About AppliedMicro

Applied Micro Circuits Corporation is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Sunnyvale, California.


TE CONNECTIVITY TE Connectivity (NYSE:TEL) is a $14 billion

global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 80,000 people, including 7,500 design engineers, partner with customers in over 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS –

CONTACT: Media Contacts: Michael Major
Applied Micro Circuits Corporation

Jennifer Grabowski
Racepoint Global for Applied Micro Circuits Corporation

Ashlee Kreiser
TE Connectivity

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X-GeneTM and X-WeaveTM represent new, grounds-up Cloud Server and connectivity solutions tailored for next generation data centers.

Our high-speed OTN connectivity products include a broad array of physical layer, framer, and mapper solutions.

Our embedded processors are widely deployed in markets such as NAS devices, wireless LAN, multi-function printers and networking equipment.

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