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APM Demonstrates X-Geneā„¢ for High-Performance Computing (HPC) Environments at ISC ‘14

June 23, 2014 | in Press Releases

SUNNYVALE, Calif., June 23, 2014 (GLOBE NEWSWIRE)—

WHERE: International Supercomputing Conference 2014, Congress Center Leipzig, Messe-Allee 1, 04356 Leipzig, Germany

WHEN: June 22-26, 2014

WHAT: Live booth demonstrations, activities with partner booths and a panel event focused on ARM 64-bit in HPC will demonstrate X-Gene’s brawny cores, large memory subsystem and high-speed I/O. Activities include:

AppliedMicro Booth no. 506: Live X-Gene-based demonstrations and videos featuring partners Eurotech, MiTAC, NVIDIA, and SoftIron

X-Gene Partner Booth Demos:

Partner Panel: Opening keynotes from AppliedMicro, HP and Sandia, followed by a partner panel discussion around HPC workloads on the X-Gene ARM 64-bit Server-on-a-Chip solution. Partners include ARM, Boston, E4 Computer Engineering, Eurotech, Mellanox and NVIDIA

Additional Resources

ISC 2014 page
X-Gene resource page
Connect with AppliedMicro via Twitter, Facebook, LinkedIn and the Blog

About AppliedMicro
Applied Micro Circuits Corporation is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Sunnyvale, California. www.apm.com.

(C) Copyright 2014, Applied Micro Circuits Corporation. AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.

CONTACT:
Investor Relations Contact:
Applied Micro Circuits Corporation
Traci Tsuchiguchi
Phone: (408) 542-8353
E-Mail: ttsuchiguchi@apm.com

Media Contact:
Applied Micro Circuits Corporation
Mike Major
Phone: (408) 542-8831
E-mail: mmajor@apm.com

Explore Our Products

X-GeneTM and X-WeaveTM represent new, grounds-up Cloud Server and connectivity solutions tailored for next generation data centers.

Our high-speed OTN connectivity products include a broad array of physical layer, framer, and mapper solutions.

Our embedded processors are widely deployed in markets such as NAS devices, wireless LAN, multi-function printers and networking equipment.

For more Press Releases from APM, please visit the Investor Relations section of our site.